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ASV 634 Silicone Based Heat Sink Compound
ASV 634 compound is used as a heat transfer media in the electrical and electronic industry for facilitating heat dissipation by filling voids and gaps between power components and heat sinks. Useful for the following applications:
Mounting Power Diodes & Transistors
Shock & Heat Dissipation in Transistors
Mounting Semi-Conductor Devices
Heat Transfer Medium on Ballasts
for Use, Use as supplied. Never dilute or mix with other oil or grease. Apply in small quantities on clean surfaces that are absolutely free from dust, foreign particles, or contaminants. Squeeze out extra compound by pressing both the surfaces after application and wipe clean to prevent accumulation of dirt & dust.
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